M. Shabanimotlagh
19 records found
1
High frame rate three-dimensional (3D) ultrasound imaging would offer excellent possibilities for the accurate assessment of carotid artery diseases. This calls for a matrix transducer with a large aperture and a vast number of elements. Such a matrix transducer should be interfaced with an application-specific integrated circuit (ASIC) for channel reduction. However, the fabrication of such a transducer integrated with one very large ASIC is very challenging and expensive. In this study, we develop a prototype matrix transducer mounted on top of multiple identical ASICs in a tiled configuration. The matrix was designed to have 7680 piezoelectric elements with a pitch of 300 μm × 150 μm integrated with an array of 8 × 1 tiled ASICs. The performance of the prototype is characterized by a series of measurements. The transducer exhibits a uniform behavior with the majority of the elements working within the −6 dB sensitivity range. In transmit, the individual elements show a center frequency of 7.5 MHz, a −6 dB bandwidth of 45%, and a transmit efficiency of 30 Pa/V at 200 mm. In receive, the dynamic range is 81 dB, and the minimum detectable pressure is 60 Pa per element. To demonstrate the imaging capabilities, we acquired 3D images using a commercial wire phantom.
@enTo accurately investigate the state of the carotid artery by the local haemodynamics and motion of the plaque using ultrasound, high-frame rate volumetric imaging is necessary. We have specifically designed a matrix array for this purpose. In this proceeding we will focus on imaging a volumetric flow profile using this matrix. For this purpose, we extend a fast frequency domain vector flow imaging method to 3D and perform measurements on a flow phantom. The results indicate that it is feasible to estimate 3D velocity vectors on a 3D grid using our matrix transducer and the proposed algorithm.
@enThis paper presents the design, fabrication and characterization of a miniature PZT-on-CMOS matrix transducer for real-time pediatric 3-dimensional (3D) transesophageal echocardiography (TEE). This 3D TEE probe consists of a 32 × 32 array of PZT elements integrated on top of an Application Specific Integrated Circuit (ASIC). We propose a partitioned transmit/receive array architecture wherein the 8 × 8 transmitter elements, located at the centre of the array, are directly wired out and the remaining receive elements are grouped into 96 sub-arrays of 3 × 3 elements. The echoes received by these sub-groups are locally processed by micro-beamformer circuits in the ASIC that allow pre-steering up to ±37°. The PZT-on-CMOS matrix transducer has been characterized acoustically and has a centre frequency of 5.8 MHz, -6 dB bandwidth of 67%, a transmit efficiency of 6 kPa/V at 30 mm, and a receive dynamic range of 85 dB with minimum and maximum detectable pressures of 5 Pa and 84 kPa respectively. The properties are very suitable for a miniature pediatric real-time 3D TEE probe.
@enThis paper presents an ultrasound transceiver application-specific integrated circuit (ASIC) designed for 3-D ultrasonic imaging of the carotid artery. This application calls for an array of thousands of ultrasonic transducer elements, far exceeding the number of channels of conventional imaging systems. The 3.6 x 6.8 mm² ASIC interfaces a piezo-electric transducer (PZT) array of 24 x 40 elements, directly integrated on top of the ASIC, to an imaging system using only 24 transmit and receive channels. Multiple ASICs can be tiled together to form an even bigger array. The ASIC, implemented in a 0.18 μm high-voltage (HV) BCD process, consists of a reconfigurable switch matrix and row-level receive circuits. Each element is associated with a compact bootstrapped HV transmit switch, an isolation switch for the receive circuits and programmable logic that enables a variety of imaging modes. Electrical and acoustic experiments successfully demonstrate the functionality of the ASIC. In addition, the ASIC has been successfully used in a 3-D imaging experiment.
@enThis paper presents a power-and area-efficient front-end application-specific integrated circuit (ASIC) that is directly integrated with an array of 32 × 32 piezoelectric transducer elements to enable next-generation miniature ultrasound probes for real-time 3-D transesophageal echocardiography. The 6.1 × 6.1 mm2 ASIC, implemented in a low-voltage 0.18-μm CMOS process, effectively reduces the number of receive (RX) cables required in the probe's narrow shaft by ninefold with the aid of 96 delay-and-sum beamformers, each of which locally combines the signals received by a sub-array of 3 × 3 elements. These beamformers are based on pipeline-operated analog sample-and-hold stages and employ a mismatch-scrambling technique to prevent the ripple signal associated with the mismatch between these stages from limiting the dynamic range. In addition, an ultralow-power low-noise amplifier architecture is proposed to increase the power efficiency of the RX circuitry. The ASIC has a compact element matched layout and consumes only 0.27 mW/channel while receiving, which is lower than the state-of-the-art circuit. Its functionality has been successfully demonstrated in 3-D imaging experiments.
@enOver the last decade, clinical studies show a strong interest in real-time 3D imaging. This calls for ultrasound probes with high-element-count 2D matrix transducer arrays. These may be interfaced to an imaging system using an in-probe Application Specific Integrated Circuit (ASIC) that takes care of signal amplification, element switching, sub-array beamforming, etc. Since the ASIC is made from silicon and is mounted directly behind the transducer elements, it can acoustically be regarded as a rigid plate that can sustain traveling lateral waves. These waves lead to acoustical cross-talk between the elements, and results in extra peaks in the directivity pattern. We propose two solutions to this problem, based on numerical simulations. One approach is to decrease the phase velocity in the silicon by reducing the silicon thickness and absorbing the energy using a proper backing material. Another solution is to disturb the waves inside the silicon plate by sub-dicing the back-side of the ASIC. We conclude that both solutions can be used to improve the directivity pattern.
@enhigh-voltage 0.18 μm BCDMOS process, that interfaces a ...
high-voltage 0.18 μm BCDMOS process, that interfaces a piezo-electric transducer array of 24 × 40 elements, directly integrated on top of the ASIC, to an imaging system using only 24 transmit and receive channels by means of a reconfigurable switch matrix and row-level low-noise amplifiers. Each element is associated with a compact bootstrapped high-voltage transmit/receive switch and programmable logic that enables a variety of imaging modes to be realized. The ASIC has been successfully used in a 3D imaging experiment.@en
Accurate assessment of carotid artery disease by measuring blood flow, plaque deformation and pulse wave velocity using ultrasound (US) imaging requires 3D information. Additionally, the volume rates should be high enough (> 1 kHz) to capture the full range of these fast transient phenomena. For this purpose, we have built a programmable, tileable matrix array that is capable of providing 3D US imaging at such volume rates. This array contains an application-specific integrated circuit (ASIC) right beneath the acoustic piezo-stack (see Fig. 1a). The ASIC enables fast programmable switching between various configurations of elements connected to the acquisition system. This design also allows for expanding the footprint by tiling several of these arrays together into one large array. We explain the working principles and show the first basic imaging results of a single matrix array.
@enAccurate assessment of carotid artery disease by measuring blood flow, plaque deformation and pulse wave velocity using ultrasound imaging requires 3D information. Additionally, the volume rates should be high enough (> 1 kHz) to capture the full range of these fast transient phenomena. For this purpose, we have built a programmable, tileable matrix array that is capable of providing 3D ultrasound imaging at such volume rates. This array contains an application-specific integrated circuit (ASIC) right beneath the acoustic piezo-stack. The ASIC enables fast programmable switching between various configurations of elements connected to the acquisition system via a number of channels far smaller than the number of transducer elements. This design also allows for expanding the footprint by tiling several of these arrays together into one large array. We explain the working principles and show the first basic imaging results of a 2-by-1 tiled array.
@enIn medical ultrasound transducer design, the geometry of the individual elements is crucial since it affects the vibration mode of each element and its radiation impedance. For a fixed frequency, optimal vibration (i.e., uniform surface motion) can be achieved by designing elements with very small width-to-thickness ratios. However, for optimal radiation impedance (i.e., highest radiated power), the width should be as large as possible. This leads to a contradiction that can be solved by subdicing wide elements. To systematically examine the effect of subdicing on the performance of a 1-D ultrasound transducer array, we applied finite-element simulations. We investigated the influence of subdicing on the radiation impedance, on the time and frequency response, and on the directivity of linear arrays with variable element widths. We also studied the effect of varying the depth of the subdicing cut. The results show that, for elements having a width greater than 0.6 times the wavelength, subdicing improves the performance compared with that of nonsubdiced elements: the emitted pressure may be increased up to a factor of three, the ringing time may be reduced by up to 50%, the bandwidth increased by up to 77%, and the sidelobes reduced by up to 13 dB. Moreover, this simulation study shows that all these improvements can already be achieved by subdicing the elements to a depth of 70% of the total element thickness. Thus, subdicing can improve important transducer parameters and, therefore, help in achieving images with improved signal-to-noise ratio and improved resolution.
@enAccurate diagnostics of stenosis and blood flow distribution in carotid arteries requires transducers capable of producing 3D volume images with high frame rate for real time imaging. In the process of designing a matrix probe, an important goal is to realize the acoustic stack with high sensitivity and bandwidth. In this study, we employ a finite element analysis to evaluate the effect of sub-dicing on the performance of an acoustic stack in a piezoelectric matrix array. The array is integrated with an Application Specific Integrated Circuit (ASIC), which performs the task of signal amplification and efficient data reduction. The results show that two sub-dicing cuts can improve the sensitivity by 40%, bandwidth by 20%, and reduce the ringing time by 43%, which are all desired for improving the image quality.
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