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QB Yao
Academic Work (1)
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Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration
Journal article (2015) -
P. Lin (author)
,
Kouchi Zhang (author)
,
Guoqi Zhang (author)
,
H.W. van Zeijl (author)
,
BH Lian (author)
,
Y. Wang (author)
,
QB Yao (author)