Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration

Journal article (2015)

Authors

P. Lin Electronic Components, Technology and Materials - EEMCS
Guoqi Zhang Electronic Components, Technology and Materials - EEMCS
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
H.W. van Zeijl Electronic Components, Technology and Materials - EEMCS
BH Lian External organisation
Y. Wang External organisation
QB Yao External organisation
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2015

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials