20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Conference paper (2024)

Authors

X. Ji Electronic Components, Technology and Materials -

L. Du Electronic Components, Technology and Materials -

H.W. van Zeijl Electronic Components, Technology and Materials -

Kouchi Zhang Electronic Components, Technology and Materials -

Guoqi Zhang Electronic Components, Technology and Materials -

Jaber Derakhshandeh IMEC-Solliance

Eric Beyne IMEC-Solliance

Research Group

Electronic Components, Technology and Materials () (TU Delft)

Flip chip All-Cu interconnects Copper nanoparticles Fine pitch

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http://resolver.tudelft.nl/uuid:15f3b891-4f68-44d7-9519-e38e2034830f

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Published Date

2024

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

This report demonstrates an innovative method to achieve large scale 20 μm pitch Cu-Cu direct bonding, utilizing lithographic stencil printing to transfer small-sized nano-copper (CuNPs) paste and employs a thermocompression method for CuNPs sintering to establish interconnections between copper-pillars and CuNPs bumps. Shear tests were conducted to characterize the bonding strength. High-throughput 20 μm pitch copper-to-copper direct bonding enables lower annealing temperatures for bulk-Cu to bulk-Cu bonding. Lithographic stencil printing is used to transfer the CuNPs paste, followed by sintering of the nanoparticles to establish interconnections. Shear tests and cross-section SEM were conducted to characterize the bonding strength and quality.

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