Thermal and mechanical effects of voids within flip chip soldering in LED packages

Journal article (2014)

Authors

Y. Liu Electronic Components, Technology and Materials -

SYY Leung External organisation

J Zhao External organisation

K.Y. Wong Electronic Components, Technology and Materials -

C.A. Yuan Electronic Components, Technology and Materials -

Guoqi Zhang Electronic Components, Technology and Materials -

Kouchi Zhang Electronic Components, Technology and Materials -

F Sun External organisation

L Luo External organisation

Research Group

Electronic Components, Technology and Materials () (TU Delft)

To reference this document use:

http://resolver.tudelft.nl/uuid:0261656a-47be-463c-9995-6b83b432ab35

More Info

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Published Date

2014

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials