Time to market is becoming one of the most important factors because of the fierce market competition. However, traditional reliability and interface toughness characterization tests take a very long time. For example, moisture sensitivity level assessment (MSL 1) will take 168 hours pre conditioning at 85C/85%RH and tradition thermal cycling takes even longer time. The long preconditioning times are chosen to ensure that also the thicker section of a package are completely saturated. Thinner packages, however, are already saturated after one to two days. In this study, we therefore investigated whether it would be possible to speed up the qualification process by shortening the preconditioning time. We focus in particular on the interface toughness. From our four point bending test and analysis, it is found that temperature has great effects on the interface toughness and moisture also has small effects on the interface toughness. In order to do the fast qualification test, thermal shock cycling tests combined with moisture absorption are performed. Experiments show that moisture can speed up the delamination.@en

For the purpose of rapidly identifying the functional weak points of SiP products and defining appropriate design rules, a new methodology is proposed to achieve fast reliability qualification.@en

The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.@en

Generally, the viscoelastic properties of packaging materials used in the simulation models are obtained from the materials after postcuring. However these properties were observed to change during humidity conditioning and the thermal cycling. Two kinds of packaging materials are tested, one is molding compound and another is underfill. All samples are cured according to the curing procedure, postcured at 180ºC. Before the test, first the samples are pre-dried at 125ºC for 24 hours and then preconditioned at 60ºC/60%RH for 40 hours. Secondly, one reflow at 260ºC. Finally, all samples are subjected to thermal cycling. Thermal cycling temperature range is from -65ºC to 150ºC and every cycle is finished in 30 minutes. For the DMA test, a TA instrument Q800 is used. Test results show the glass modulus, rubber modulus and glass transition temperature increase with the number of thermal cycles. This change in materials after humidity and thermal treatment is here referred to as aging. The finite element software Marc is used to simulate the internal change of stress and displacement. The simulation result shows that the total warpage has increased a little at the corner of passive die, which is where the critical cracks and crazes were found in our qualification tests. And the Von Mises stresses increase after thermal cycling.@en