Recent years, the sintered silver paste was introduced and further developed for power electronics packaging due to low processing temperature and high working temperature. The pressure-less sintering technology reduces the stress damage caused by the pressure to the chip, improves reliability, and is widely applied in manufacturing. Currently, most existed studies are focused on alcohol-based sintered silver pastes while resins have been demonstrated to improve the bonding properties of solder joints. Hence, the performance and sintering mechanisms with epoxy-based silver paste need to be further explored. In this work, a methodology for multifactor investigation is settled on the epoxy-based silver paste to reveal the relationship between the strength and the different influence factors. We first analyzed the characteristics of commercialized epoxy-based silver paste samples, including silver content, silver particle size, organic composition, sample viscosity, and thermal conductivity. Samples were then prepared for shear tests and microstructure analysis under different pressure-less sintering temperatures, holding time, substrate surface, and chip size. Full factor analysis results were further discussed in detail for correlation. The influence factors were ranked from strong to weak as follows: sintering temperature, substrate surface, chip size, and holding time. Finally, a thermal cycling test was carried out for reliability analysis. Epoxy residues are one of the possible reasons, which result in shear strength decreasing exponentially.

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With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from high prices and electromigration. Therefore, a novel sintered material based on silver-copper core-shell structured particles raises the attention of researchers to solve this deficiency. To accelerate the development of new materials and their related processes, a four-sphere model of the silver-coated copper structure is established in this paper. The mathematical relationship between the porosity and thermal conductivity of sintered body and the actual sintering process was preliminarily established through the calculation based on a series of FEM simulations. The model was further validated through experiments. The modeling method and conclusion are utilized for future process adjustment, which is of great significance to accelerate the development, application, and reliability of new packaging materials.@en

This study investigates the effects of nanofillers on the interfacial transition zone (ITZ) between aggregate and cement paste by using nanoindentation and statistical nanoindentation techniques. Moreover, the underlying mechanisms are revealed through micromechanical modeling. The nanoindentation results indicate that incorporating nanofillers increases the degree of hydration in the ITZ, reduces the content of micropores and low-density calcium silicate hydrate (LD C–S–H), and increases the content of high-density C–S–H (HD C–S–H) and ultrahigh-density C–S–H (UHD C–S–H). In particular, a new phase, namely nano-core-induced low-density C–S–H (NCILD C–S–H), with a superior hardness of 2.50 GPa and an indentation modulus similar to those of HD C–S–H or UHD C–S–H was identified in this study. The modeling results revealed that the presence of nanofillers increased the packing density of LD C–S–H and significantly enhanced the interaction (adhesion and friction) among the basic building blocks of C–S–H gels owing to the formation of nano-core–shell elements, thereby facilitating the formation of NCILD C–S–H and further improving the performance of the ITZ. This study provides insight into the effects of nanofillers on the ITZ in concrete at the nanoscale.

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