With the increased deployment of power modules in demanding conditions, sintering materials, especially composite sintering materials, have raised growing interest due to their cost-effectiveness and suitability. Therefore, this study explores the viability of Cu–Ag composite sintering material, focusing on solvent influence through microstructure and mechanical behavior analysis. Micron-sized particle-based Cu–Ag composite pastes were designed and compared using eight solvents (four epoxy-free and four epoxy-added) based on fluidity and thermal stability. The sintered joints' performance, assessed through shear strength analysis, showed comparable values to pure silver sintering for both epoxy-free and epoxy-added samples. Optimized samples from each solvent system underwent reliability analysis, demonstrating that Cu–Ag joints with epoxy resin exhibited significantly higher shear strength after high-temperature storage and thermal cycling tests. Micromorphology and elemental composition analysis revealed differences in aging mechanisms, primarily attributed to variations in porosity due to oxide formation and pore filling by epoxy resin under different solvent systems. Further nanoindentation characterization of micromechanical properties, including hardness, modulus, and creep properties, during high-temperature aging, established constitutive models for insights into reliability evolution. In conclusion, the optimized epoxy-added Cu–Ag sintered joints proposed in this study demonstrated exceptional reliability and acceptable micromechanical properties, presenting a promising option for high-temperature power packaging.

Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H₂S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under different solvent systems. Such samples were firstly subjected to high-humidity-H₂S conditions for 168 h to simulate the harsh offshore environment. After undergoing corrosion, the primary compounds formed were CuO/Cu₂O and Ag₂S through SEM, XRD, and XPS analysis. Notably, the incorporation of epoxy resin into sintered copper joints resulted in a remarkable reduction in corrosion and a substantial improvement in electrical conductivity after the reaction. In contrast, while the addition of epoxy did not evidently reduce corrosion in silver joints, it did lead to a significant increase in shear strength. Furthermore, to gain further insights into the effect of epoxy resin on corrosion behavior, electrochemical analysis, and molecular dynamics simulations were conducted. Finally, the mechanical reliability of the corroded copper and silver joints was evaluated through thermal shock tests. In summary, sintered copper joints exhibited better anti-corrosion behaviors than sintered silver under high humidity and H₂S exposure, especially with the addition of epoxy resin. However, the corrosion products of sintered copper suffered from a sharp decrease in shear strength after thermal shock tests than sintered silver, which is probably due to the coefficient of thermal expansion mismatch.

With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost and anti-electro migration ability. However, the potential difference between copper and silver forms galvanic corrosion in a high-humidity environment, resulting in accelerated failure combined with salt mist. To further promote the application of composite sintered materials, a copper-silver double-sphere galvanic corrosion model based on finite element simulation was proposed in this paper. The relationship between corrosion rate and time of different Cu-Ag particle size combinations under different sintering degrees was predicted by initial exchange current density. Through the electrochemical characterization of the sintered samples, the optimal combination of materials was further discussed. The accuracy of the model was also verified. The conclusions obtained from both the experiments and simulation work provide guidance for future anti-corrosion analysis, as well as the reliability improvement of novel composite sintered materials.

With the development of electronic technology towards high power, miniaturization, and system integration, power electronic packaging is facing increasing challenges, especially for die attachment. This research aims to explore silver-coated copper (Cu@Ag) paste with sufficient mechanical properties and high-temperature reliability, as an alternative solution for silver sintering with lower cost. Firstly, micro-Cu@Ag sintering pastes were investigated under four kinds of polyol-based solvent systems and two types of particle morphologies, which included sphere-type (SCu@Ag) and flake-type (FCu@Ag). Sintering performance and microstructural evolution were compared and analyzed. Notably, sintered joints employing the terpineol–polyethylene glycol solvent system and flake-type morphology displayed a denser microstructure in comparison to SCu@Ag joints. Its bonding strength reached 36.15 MPa, which was approximately 20% higher than SCu@Ag joints. Subsequently, the influence of key sintering process parameters on Cu@Ag joints was analyzed, including sintering temperature, pressure and time. Additionally, high-temperature aging and thermal cycling tests were conducted on the optimized Cu@Ag joints to assess their reliability. Finally, the micromechanical properties of Cu@Ag joints before and after high-temperature aging were further evaluated by nanoindentation including creep properties. The elastoplastic constitutive models of Cu@Ag sintered materials with different particle morphologies were constructed, providing valuable insights for reliability evaluation. The results indicated that FCu@Ag joints exhibited satisfactory creep resistance and high-temperature reliability. In conclusion, the FCu@Ag micro-paste based on the terpineol–polyethylene glycol solvent system proposed in this study demonstrated sufficient bonding strength, high reliability, and adequate mechanical properties as an attractive solution for high-temperature power electronics packaging.