Thermo-Mechanical Virtual Prototyping of Laminate-Based RF System-in-Package Modules

Conference paper (2006)

Authors

DG Yang External organisation
W.D. van Driel Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
RWJ van den Boomen External organisation
F Meeuwsen External organisation
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2006

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems

Abstract

Laminate-based and Silicon-based SiP approaches for RF modules are described. Laminate-based SiP approach is the mostly used one in the integration of RF modules. Failure modes, such as delamination, via cracking, excessive substrate deformation and cracking, were observed during the major packaging processes and the qualification tests with a Moisture Sensitivity Level 3 followed with a lead-free reflow profile. Experimental and virtual thermo-mechanical prototyping methodology is implemented to investigate the root cause of the failures. Advanced modeling approach is applied to model the integrated thermo-mechanical and moisture-related stress and strains.