Compact Thermal Model of a Multi Die Power Stage with In-Package Sensing for Remaining Useful Life Prediction
Ole J. Bergmann (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Henk W. Van Zeijl (TU Delft - QCD/Haider Group)
Willem D. Van Driel (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Guo Qi Zhang (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Rene H. Poelma (TU Delft - Electrical Engineering, Mathematics and Computer Science)
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Abstract
The paper presents a degradation for remaining useful lifetime framework for smart power stages (SPS) with an integrated temperature sensor for electronic control units (ECU). A reduced order state space model with physically meaningful time constants is derived from finite element simulations. The state space model is the core of the damage estimation of the SPS during operation. A framework for remaining useful lifetime estimation is presented simulating degradation based on an estimated mission profile for cars. Temperature cycles are extracted and used to estimate the time constant drift representing package degradation. An exemplary approach on how to integrate degradation monitoring into a lifetime approximation of the package is presented. The state space model is extended for estimator based predictions to integrate the model in future test benches for real life monitoring and remaining useful life predictions of active devices.
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