Experimental analysis of mode I crack propagation in adhesively bonded joints by optical backscatter reflectometry and comparison with digital image correlation

Journal article (2021)

Authors

Rosemere de Araujo Alves Lima Politecnico di Milano

Ricardo Perrone Politecnico di Milano

M. Carboni Politecnico di Milano

Andrea Bernasconi Politecnico di Milano

Affiliation

External organisation

Crack propagation Optical Backscatter Sensor Digital image correlation (DIC) Adhesive bond

To reference this document use:

http://resolver.tudelft.nl/uuid:f9ddb5ed-3025-4aba-aa11-3fef148f01cb

More Info

expand_more

Published Date

2021

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Affiliation

External organisation

Abstract

The relationship between the response of backface strain distributed sensing by Optical Backscatter Reflectometry and the damage in the adhesive was studied using double cantilever beam specimens. Digital Image Correlation and visual inspection provided information about the crack-tip position and the extension of the cohesive process zone. The comparison between the features of the backface strain pattern and the position and size of the cohesive zone led to the conclusion that, for the studied adhesive, backface distributed sensing allows for the onset of plastic deformations ahead of the crack-tip to be identified, opening new perspectives for fatigue crack monitoring and in-service measurements.