Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes

Journal article (2015)

Authors

Y Liu External organisation
F Sun External organisation
H Zhang External organisation
T Xin External organisation
C.A. Yuan Electronic Components, Technology and Materials - EEMCS
Guoqi Zhang Electronic Components, Technology and Materials - EEMCS
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2015

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials