Micromachining for Advanced Terahertz

Interconnects and Packaging Techniques at Terahertz Frequencies

Journal article (2020)

Authors

M. Alonso Del Pino California Institute of Technology, Tera-Hertz Sensing - EEMCS
Cecile Jung-Kubiak California Institute of Technology
Theodore James Reck Virginia Diodes Inc.
Choonsup Lee California Institute of Technology
G. Chattopadhyay Virginia Diodes Inc.
Research Group
Tera-Hertz Sensing (EEMCS) (TU Delft)
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Published Date

2020-1

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Tera-Hertz Sensing

Abstract

It is difficult to package and interconnect components and devices at millimeter-waves (mm-waves) due to excessive losses experiences at these frequencies using traditional techniques. The problem is multiplied manifold at terahertz (THz) frequencies. In this article, we review the current state of THz packaging and describe several novel techniques. As we will show, micromachined packaging is emerging as one of the best choices for developing advanced THz systems.

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