Electrodeposited Sn-Cu-Ni alloys as lead-free solders on copper substrate using deep eutectic solvents

The influence of electrodeposition mode on the morphology, composition and corrosion behaviour

Journal article (2024)

Authors

Sabrina Patricia State Politehnica University of Bucharest
Stefania Costovici Politehnica University of Bucharest
M. Mousavi Team Yaiza Gonzalez Garcia - Mechanical, Maritime and Materials Engineering
Y. Gonzalez Garcia Team Yaiza Gonzalez Garcia - Mechanical, Maritime and Materials Engineering
Caterina Zanella Jönköping University
Anca Cojocaru Politehnica University of Bucharest
Liana Anicai Politehnica University of Bucharest
Teodor Visan Politehnica University of Bucharest
Marius Enachescu Politehnica University of Bucharest
Research Group
Team Yaiza Gonzalez Garcia (Mechanical, Maritime and Materials Engineering) (TU Delft)
Copyright: © 2024 Sabrina Patricia State, Stefania Costovici, M. Mousavi, Y. Gonzalez Garcia, Caterina Zanella, Anca Cojocaru, Liana Anicai, Teodor Visan, Marius Enachescu
DOI: https://doi.org/10.1016/j.surfcoat.2023.130324
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Published Date

2024

Language

English

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Materials Science and Engineering

Research Group

Team Yaiza Gonzalez Garcia

Abstract

In this work we present the pulsed current (PC) electrodeposition of Sn-Cu-Ni alloy as lead-free solder candidate, from choline chloride – ethylene glycol eutectic mixtures (1:2 molar ratio) onto copper metallic substrates. Electrolytes containing Sn2+, Cu2+ and Ni2+ salts in the selected deep eutectic solvent have been considered. The effect of the applied frequency of PC on the morphology, composition and melting point of the alloy is discussed and compared to the ones obtained using direct current (DC) plating mode. A refinement of the grain size and lower melting temperature of the alloy were noticed when pulsed current was applied. A comparative analysis of the electrochemical corrosion behaviour at macro- and micro- scale has been performed in 0.5 M and 0.1 M NaCl solutions involving potentiodynamic polarization curves, electrochemical impedance spectroscopy (EIS) and scanning vibrating electrode (SVET) techniques. Furthermore, an analysis after 96 h of exposure to salt mist test simulating a corrosive attack in harsh environment is presented, too. The obtained results showed enhanced corrosion resistance of the ternary alloys electrodeposited under PC conditions (the best for 1.67 Hz frequency) as compared to those using DC. Additionally, Raman spectroscopy evidenced the presence of tin oxi/hydroxy chloride and tin oxides as surface corrosion products. A corrosion mechanism has been proposed.

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