Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation

Conference paper (2015)

Authors

J Tang External organisation
MR Curiel External organisation
SL Furcone External organisation
EGJ Reinders External organisation
CTA Revenberg External organisation
C.I.M. Beenakker Electrical Engineering, Mathematics and Computer Science
Faculty
Electrical Engineering, Mathematics and Computer Science
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Published Date

2015

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science