Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding

Conference paper (2009)

Authors

J.J.M. Zaal Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
W.D. van Driel Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
GJAM Verheijden External organisation
Kouchi Zhang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Guoqi Zhang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2009

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

With the ever-growing number of MEMS resonator applications, a research effort is required. One important step to consider in the design and evaluation phase is the packaging of such a resonator.