Thermal-mechanical coupling simulation of Chiplet 2.5D packaging based on chiplet distribution and Full Copper Interconnection

Abstract

The semiconductor industry is facing significant challenges, including physical limitations such as heat dissipation, rising manufacturing costs, and the difficulty of further shrinking transistor sizes while maintaining performance. To address these issues, chiplet technology has emerged, integrating smaller, specialized chips into a single package. This approach improves modularity, manufacturing yields, and allows mixing different technology nodes for optimal performance. However, challenges like ensuring high-speed, low-latency interconnects and effective thermal management persist.This study explores several key aspects of chiplet technology using a simplified dual-chip model, focusing on the integration of nanocopper materials. By comparing nanocopper with traditional solder, we analyze differences in mechanical behavior and thermal management. Additionally, we investigate variations in chiplet layout, examining the impact of spacing and the number of chiplets on performance under identical power conditions. Our findings indicate that nanocopper interconnects provide lower stress and better thermal conductivity than traditional solder. Adjusting chiplet spacing and increasing the number of chiplets both enhance heat dissipation. Future work will involve larger-scale simulations and fatigue analyses to optimize chiplet packaging for improved performance and reliability.