High aspect ratio through-wafer interconnections for 3D-microsystems

Conference paper (2003)

Authors

L Wang Electronic Components, Technology and Materials -

A Nichelatti Electronic Components, Technology and Materials -

H. Schellevis Electronic Components, Technology and Materials -

C.R. de Boer Electronic Components, Technology and Materials -

C.C.G. Visser Electronic Components, Technology and Materials -

NT Nguyen Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

Pasqualina M. Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

Elektrotechniek Techniek

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More Info

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Published Date

2003

Language

Undefined/Unknown

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials