Reliability Modelling for Packages in Flexible End-Products

Journal article (2006)

Authors

W.D. van Driel Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
O van der Sluis Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
DG Yang External organisation
RLJM Ubachs Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
C Zenz External organisation
G Aflenzer External organisation
Guoqi Zhang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Kouchi Zhang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2006

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems

Abstract

Flexible end-products like banking cards and wearable electronics are about to pervade our lives massively. Due to the fact that flexibility is a must, reliability problems are expected due to the mechanical handling loading conditions the end-product is subjected to. This paper presents our effort to predict reliability problems for packages in flexible end-products. Current field returns indicate that mechanical loadings are causing crack failures in dies and packages. Both parametric 2D and 3D Finite Element models are constructed to analyse the impact of such loadings to the stress levels in the constituents. The results gain a better understanding of reliability issues and, where possible, give suggestions for preventing such issues. With the aid of the simulation results mechanical test methodologies can be designed suitable as to insure a given lifetime statement.