Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull

Journal article (2009)

Authors

J.J.M. Zaal Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
HP Hochstenbach External organisation
W.D. van Driel Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Kouchi Zhang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Guoqi Zhang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2009

Language

Undefined/Unknown

Reuse Rights

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

The use of microelectronic components in mobile appliances is constantly increasing. Appliances like mobile phones, PDA's and navigation systems contain more and more functionality and smaller microelectronic components.