Mechanical reliability challenges for MEMS packages: Capping

Journal article (2007)

Authors

W.D. van Driel Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
D Yang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
C.A. Yuan Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
M van Kleef External organisation
Kouchi Zhang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Guoqi Zhang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2007

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems

Abstract

This paper presents our effort to predict reliability problems for MEMS packages. MEMS devices are vulnerable to the external loads subjected to it. As such, MEMS devices need to be protected. Protections can be generated by capping the device: a piece of silicon is placed on top of it to create a cavity above it. Parametric finite element models are combined with dedicated verification experiments to address the reliability of four different capping concepts. The results gain a better understandig of MEMS capping issues, with failure modes as cavity deflection, cap fractures, and moisture penetration.