Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect

Conference paper (2023)

Authors

Z. Cui Electronic Components, Technology and Materials - EEMCS
X. Fan Lamar University
Guoqi Zhang Electronic Components, Technology and Materials - EEMCS
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2023 Z. Cui, X. Fan, Kouchi Zhang
DOI: https://doi.org/10.1109/ECTC51909.2023.00226
More Info
expand_more

Published Date

2023

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

In this paper, we apply the Eshelby's solution to study the effect of passivation layer on electromigration (EM) failure in a conductor. The passivation layer is considered as an elastic material, not a rigid layer anymore. Thus, the deformation and stress evolution in the conductor during EM are related to the mechanical property of the passivation layer. One-dimensional (1D) analytical solution for the passivated conductor is obtained. The numerical results show that the conductor covered with the stiffer passivation layer has much less EM damage. And the steady-state solution shows that the magnitude of (jL)c increases with increasing Young's modulus of passivation material. The present study provides a way to predict the EM performances taking into account various passivation materials.

Files

Effect_of_Passivation_and_Mech... (pdf)
(pdf | 0.664 Mb)
- Embargo expired in 03-02-2024
Unknown license