A novel SOI Pirani sensor with triple heat sinks

Conference paper (2009)

Authors

Q Li Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
J.F.L. Goosen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
JMT Beek External organisation
A. van Keulen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2009

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

In this paper, we will present a novel MEMS Pirani sensor with triple heat sinks. The sensors are made on SOI (Silicon On Insulator) wafers leading to a very simple process and good mechanical structures as compared to alternative surface micromachining processes. Moreover, the proposed Pirani has three heat sinks. The area of heat loss through the ambient gas is greatly enlarged as compared to Pirani sensors with one or dual heat sinks without increasing the dimension of the sensor. Consequently, the dynamic pressure range of the Pirani sensor will be enlarged.

Keywords: Pirani; SOI; Triple; Heat sink; Pressure; Sensor