Synergistic toughening of epoxy¿copper interface using a thiol-based coupling layer

Journal article (2011)

Authors

K.Y. Wong Electronic Components, Technology and Materials - EEMCS
SYY Leung Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
H. Fan Applied Geophysics and Petrophysics - CEG
MMF Yuen External organisation
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2011

Language

Undefined/Unknown

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials