Testing Solder Interconnect Reliability Under Drop Impact Loading Conditions

Conference paper (2008)

Authors

J.J.M. Zaal Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
HP Hochstenbach External organisation
W.D. van Driel Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
Kouchi Zhang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
Guoqi Zhang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2008

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

The use of microelectronic components in mobile appliances is constantly increasing. Appliances like mobile phones, PDA's and navigation systems contain more and more functionality and smaller microelectronic components. Dropping an appliance during its lifespan is very common and the product is required to survive this. The drop however generates significant forces and vibrations on the internal assembly of the product. The performance of a microelectronic component under drop conditions has thus become an important reliability parameter.
Assessing the solder interconnect quality by means of drop impact testing, as standardized by e.g. JEDEC, during normal production requires considerable amounts of time and effort. Besides this, the repeatability of the drop impact test is low and introduces elaborate and time-consuming analysis of the results after testing.
Already many researchers have investigated new test techniques capable of replacing the drop impact test, e.g. high-speed shear [1], pull [2] and bending. Among those tests is the High Speed Cold Bump Pull test (HSCBP or CBP). In the CBP test the solder bump is pulled in vertical direction from the die using a small pair of jaws. In this test, by varying the pull speed several different strain-rates can be applied to the solder bump.
In our research a correlation between the drop impact test and cold bump pull test is investigated. This can be divided into three parts. First by investigating the cold bump pull test apparatus for uncontrolled parameters that might introduce a biass or spread in the results. Secondly by means of modeling the cold bump pull test to investigate solder bump deformation and solder bump loading during pull-off. Finally in a comparison the differences and similarities between the two tests are briefly discussed and some observations concerning the solder joint performance are presented.
The correlation between the two tests is focused on a method capable of translating the loading conditions experienced in the drop impact test towards a cold bump pull test prescription. Several numerical simulations have been used to investigate the solder ball during deformation and destruction. The cold bump pull experiments are used to rule out as much variances as possible and improvements for the cold bump pull apparatus are proposed.