High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material

Conference paper (2023)

Authors

L. Du Electronic Components, Technology and Materials - EEMCS
Xiujuan Zhao Signify
René H. Poelma Nexperia B.V., Electronic Components, Technology and Materials - EEMCS
W.D. van Driel Electronic Components, Technology and Materials - EEMCS , Signify
Guoqi Zhang Electronic Components, Technology and Materials - EEMCS
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2023 L. Du, Xiujuan Zhao, René H. Poelma, W.D. van Driel, Kouchi Zhang
DOI: https://doi.org/10.1109/ECTC51909.2023.00072
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Published Date

2023

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties of SnBiAgCu solder alloy under different temperatures. Results show that the addition of Bi resulted in better creep resistance compared with that of commercial SAC305 (Sn-3.0Ag-0.5Cu). Secondly, dynamic mechanical analyses were performed to get the storage modulus and glass transition temperature of potting compounds. Finally, a finite element modeling based analysis were used to figure out the different failure mechanism due to the presence of potting materials. The accurate simulation data offers an optimization reference for the selection of solder and potting materials.

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